专利名称：A method of improving bond strength
between a metal layer and a non-metallicsubstrate
发明人：Zsamboky, Kalman F.申请号：EP87117841.4申请日：19871202公开号：EP0273227A3公开日：19890125
摘要：A method of improving the bond strength between a plated metal layer and anon-metallic ceramic substrate. The method comprises the steps of: baking the substrateto remove any organic compounds on or within the substrate and any holes or
indentations therein, plating a layer of metal, such as copper, on the substrate, and firingthe substrate at a temperature slightly above the eutectic point of the metal to cause astrong bond to be formed between the metal layer and the ceramic substrate.
申请人：Zsamboky, Kalman F.
地址：14900 County Road 79 Elk River Minnesota 55330 US
国籍：US
代理机构：Schwan, Gerhard, Dipl.-Ing.
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