专利名称：Package structure and method发明人：Yu-Lin Yang申请号：US12453405申请日：20090511
公开号：US20090283896A1公开日：20091119
专利附图：
摘要：A semiconductor die has a surface and an active region on the surface. A thick-film coating is applied to the surface of the semiconductor die to cover only a portion orentire of the active region before the semiconductor die is cut from a wafer. The thick-film coating reduces the stress to the semiconductor die. The thick-film coating does not
cover the bonding pads of the semiconductor die to avoid influencing the bonding wiresbonding to the boding pads.
申请人：Yu-Lin Yang
地址：Zhuhei City TW
国籍：TW
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