专利名称：Method and mounting device for mounting a
component at a specific position
发明人：Sakurai, Hiroshi,Onodera, Hitoshi申请号：EP97118277.9申请日：19941227公开号：EP0833555A2公开日：19980401
专利附图：
摘要：Method for mounting a component at a specific position, especially a chipcomponent onto a substrate such as a printed circuit board, comprising the steps ofpicking up the component through a pick up nozzle from a component supply unit,
transferring the component and mounting the same at the desired position, and placingthe component in a detecting area of a position detecting means emitting parallel lightbeams for detecting a projected width of the component under rotation of the same toobtain a correction value for mounting the component precisely. The method is improvedby the steps of calculating a detection error in said projected width due to light
diffraction on the basis of a distance between the component in the detecting area and adetecting section (31b) of said position detecting means, calculating a component widthon the basis of said projected width and said detection error, and comparing saidcomponent width with a reference value for deciding whether or not the component ispicked up correctly.
申请人：YAMAHA HATSUDOKI KABUSHIKI KAISHA
地址：2500 Shingai Iwata-shi Shizuoka-ken, 438 JP
国籍：JP
代理机构：Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
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